Title:
SILICONE ADHESIVE COMPOSITION, ADHESIVE FILM, AND ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2019/142779
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a silicone adhesive composition that gives an adhesive layer having excellent adhesion to a substrate by a single coating step, as well as minimal increase in adhesive force over time, and an adhesive film or adhesive tape having an adhesive layer obtained by curing the composition. [Solution] A silicone adhesive composition including components (A) through (E). (A): 40-100 parts by mass of a straight-chain or branched organopolysiloxane having at least two alkenyl groups in each molecule thereof, the alkenyl group content being 0.0005 mol/100 g to less than 0.15 mol/100 g. (B): 60-0 parts by mass (the total amount of components (A) and (B) being 100 parts by mass) of an organopolysiloxane which has R2
3SiO1/2 units and SiO4/2 units (R2 in the formula being, independently of each other, a substituted or unsubstituted C1-10 univalent hydrocarbon group) and in which the mole ratio represented by (R2
3SiO1/2 units)/(SiO4/2 units) is 0.5-1.5, and which may arbitrarily have a hydroxyl group or alkoxy group bonded to a silicon atom. (C): An amount of an organohydrodiene polysiloxane such that the ratio of the number of SiH groups in component (C) to the number of alkenyl groups in component (A) is 0.5-15, the organohydrodiene polysiloxane having three or more hydrogen atoms bonded to a silicon atom in each molecule thereof and not having an aryl group. (D): A catalytic amount of a platinum-group-metal-based catalyst. (E): 0.01-10 parts by mass of an organohydrodiene polysiloxane with respect to a total of 100 parts by mass of components (A) and (B), the amount of the organohydrodiene polysiloxane being such that the ratio of the number of SiH groups in component (E) to the number of alkenyl groups in component (A) is 0.1-15, the organohydrodiene polysiloxane having three or more hydrogen atoms bonded to a silicon atom in each molecule thereof and having an aryl-group-containing organic group, and the percentage of the total number of aryl-group-containing organic groups with respect to the total number of hydrogen atoms bonded to a silicon atom and groups bonded to a silicon atom being 5% to 40%.
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Inventors:
NAKAYAMA KEN (JP)
KURODA YASUYOSHI (JP)
KURODA YASUYOSHI (JP)
Application Number:
PCT/JP2019/000909
Publication Date:
July 25, 2019
Filing Date:
January 15, 2019
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09J183/05; C09J7/38; C09J11/06; C09J183/07
Domestic Patent References:
| WO2015194389A1 | 2015-12-23 | |||
| WO2015093283A1 | 2015-06-25 |
Foreign References:
| JP2015178584A | 2015-10-08 | |||
| JP2010116324A | 2010-05-27 | |||
| JP2012184350A | 2012-09-27 | |||
| JP2014047310A | 2014-03-17 | |||
| JP2013060493A | 2013-04-04 |
Attorney, Agent or Firm:
MATSUI Mitsuo et al. (JP)
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