Title:
SILICONE ADHESIVE COMPOSITION, ADHESIVE TAPE, AND ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2023/195390
Kind Code:
A1
Abstract:
[Problem] To provide: a silicone adhesive composition for forming an adhesive layer capable of maintaining high adhesive strength and holding power even at high temperatures above 150°C; and an adhesive tape and an adhesive film comprising an adhesive layer made of a cured product of the adhesive composition. [Solution] The present invention provides a silicone adhesive composition containing components (A)-(D) below: (A) a linear organopolysiloxane having at least two alkenyl groups in one molecule and an alkenyl group content of 0.0001-0.03 mol/100 g, at 20-65 parts by mass; (B) an organopolysiloxane resin having at least one alkenyl group in one molecule and further having R3 3SiO1/2 and SiO4/2 units, wherein the molar ratio represented by (R3 3SiO1/2 unit)/(SiO4/2 unit) is 0.5-1.5 (in the formula, R3's are each independently a substituted or unsubstituted C1-10 monovalent hydrocarbon group), at 35-80 parts by mass (provided that the total amount of components (A) and (B) is 100 parts by mass); (C) an organohydrogenpolysiloxane having at least three hydrogen atoms bonded to a silicon atom in one molecule, wherein in component (C), the ratio of the total number of hydrogen atoms bonded to the silicon atom to the total number of hydrogen atoms bonded to the silicon atom and groups bonded to the silicon atom is 20-50%, and the average polymerization degree of siloxane is 100 or less, in an amount such that the ratio of the total number of SiH groups in component (C) to the total number of alkenyl groups in components (A) and (B) is 0.1-2.0; and (D) a platinum group metal-based catalyst, in a catalytic amount. In addition, the present invention provides a cured product obtained by curing the silicone adhesive composition, and an adhesive tape or adhesive film comprising the cured product (adhesive layer).
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Inventors:
NAKAYAMA KEN (JP)
Application Number:
PCT/JP2023/012585
Publication Date:
October 12, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09J11/06; C09J7/38; C09J183/04; C09J183/05; C09J183/07
Domestic Patent References:
| WO2020026844A1 | 2020-02-06 | |||
| WO2019142779A1 | 2019-07-25 |
Foreign References:
| JP2007191637A | 2007-08-02 | |||
| JP2014205762A | 2014-10-30 | |||
| JP2004117831A | 2004-04-15 | |||
| JP2009051916A | 2009-03-12 |
Attorney, Agent or Firm:
MURAKAMI Hiroshi et al. (JP)
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