SILICONE ADHESIVE FILM AND SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2015/093329

A1

A silicone adhesive film obtained by hydrosilylation, the B-stage, of a silicone composition comprising at least (A) an organopolysiloxane having a phenyl group and an alkenyl group, (B) an arbitrary diorganopolysiloxane having a phenyl group and an alkenyl group, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule thereof, (D) an adhesion promoter, and (E) a hydrosilylation catalyst. This B-stage silicone adhesive film softens readily and exhibits good gap-filling properties even in thermocompression bonding at relatively low temperature/pressure to an adherend having gaps on the surface thereof, and can harden and bond securely to the adherend.

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FUJISAWA TOYOHIKO (JP)
YAMAZAKI HARUNA (JP)
YAMAZAKI RYOSUKE (JP)
YOSHITAKE MAKOTO (JP)

PCT/JP2014/082350

June 25, 2015

December 01, 2014

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DOW CORNING TORAY CO LTD (JP)

C09J7/10; C09J11/06; C09J183/05; C09J183/07; H01L21/52

JP2007246842A	2007-09-27
JP2006063092A	2006-03-09
JP2013518142A	2013-05-20
JPH1112546A	1999-01-19

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