Title:
SILICONE COMPOSITION, HEAT DISSIPATING MEMBER, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/243706
Kind Code:
A1
Abstract:
A silicone composition comprising: (a) an organopolysiloxane having at least two alkenyl groups per molecule; (b1) an organohydrogen polysiloxane having, at a side chain of the molecule chain thereof and at both terminals of the molecule chain thereof, hydrogen atoms directly bonded to silicon atoms; (b2) an organohydrogen polysiloxane having, only at both terminals of the molecule chain thereof, hydrogen atoms directly bonded to silicon atoms; (c) a thermoconductive filler; (d) a curing catalyst; and (e) an organopolysiloxane not having an addition reaction group, wherein the ratio (H/Vi) of the number of hydrogen atoms directly bonded to silicon atoms with respect to the number of alkenyl groups is in a range of 0.5-1.5.
Inventors:
INUI OSAMU (JP)
NISHIZAWA HIDEHITO (JP)
NISHIZAWA HIDEHITO (JP)
Application Number:
PCT/JP2023/022389
Publication Date:
December 21, 2023
Filing Date:
June 16, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L83/07; C08K3/013; C08L83/05; C08L83/06; H01L23/373
Domestic Patent References:
| WO2015178140A1 | 2015-11-26 | |||
| WO2017098961A1 | 2017-06-15 | |||
| WO2020145249A1 | 2020-07-16 | |||
| WO2009060616A1 | 2009-05-14 |
Foreign References:
| JP2012153774A | 2012-08-16 | |||
| JPH11124503A | 1999-05-11 | |||
| JP2011046826A | 2011-03-10 | |||
| JP2000204259A | 2000-07-25 | |||
| JP2018123310A | 2018-08-09 | |||
| CN110499032A | 2019-11-26 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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