Title:
SILICONE COMPOSITION AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/040777
Kind Code:
A1
Abstract:
The present invention is a silicone composition that comprises (A) an organopolysiloxane including at least two aliphatic unsaturated hydrocarbon groups in a single molecule, (B) a filler including an aluminum powder and a zinc oxide powder, (C) an organohydrogen polysiloxane including two or more SiH groups in a single molecule, and (D) a platinum-group metal catalyst, the silicone composition producing a cured product wherein, when the storage modulus G' and the loss modulus G'' of the silicone composition are measured by using a viscoelasticity measurement device that can measure shear elasticity, said G' after 3,000 seconds from the start of retention is 10,000 Pa or less, said G' after 7,200 seconds is 100,000 Pa or less, and it takes 800 seconds or longer from the start of retention for said G' to exceed G''. Thus, a silicone composition having excellent collapsibility, spreadability, and thermal conductivity, and a method for producing a thermally conductive silicone composition are provided.
Inventors:
KITAZAWA KEITA (JP)
YAMADA KUNIHIRO (JP)
YAMADA KUNIHIRO (JP)
Application Number:
PCT/JP2014/003157
Publication Date:
March 26, 2015
Filing Date:
June 13, 2014
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/08; C08K3/22; C08K5/05; C08K5/16; C08K5/33; C08K5/50; C08L83/05; C08L83/06; C09K5/08
Foreign References:
| JP2011246536A | 2011-12-08 | |||
| JP2012102283A | 2012-05-31 | |||
| JP2005154532A | 2005-06-16 | |||
| JP2009292928A | 2009-12-17 | |||
| JP2011088953A | 2011-05-06 | |||
| JP2010059237A | 2010-03-18 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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