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Title:
SILICONE COMPOSITION FOR RELEASE PAPER OR RELEASE FILM, AND RELEASE PAPER AND RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2017/010340
Kind Code:
A1
Abstract:
A compound that is devoid of epoxy groups and has a quantity of alkenyl groups corresponding to 5-1000 times the alkenyl group content of a base polymer, and/or an organopolysiloxane that is devoid of alkenyl groups, has an average degree of polymerization of 2-50, and contains, per molecule, 30 mol% or more of siloxane units having epoxycyclohexyl groups bonded to silicon atoms via carbon atoms, are/is blended with a silicone composition for a release film as adhesion-enhancing components.

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Inventors:
NAKAYAMA KEN (JP)
Application Number:
PCT/JP2016/069855
Publication Date:
January 19, 2017
Filing Date:
July 05, 2016
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
B32B27/00; C09K3/00; C09D5/20; C09D7/12; C09D183/07; D21H19/32; D21H27/00; C08L83/05; C08L83/07
Foreign References:
JP2011132532A2011-07-07
JP2011252142A2011-12-15
JPH04323284A1992-11-12
JP2016023288A2016-02-08
Other References:
See also references of EP 3323867A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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