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Patent Searching and Data


Title:
SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/103424
Kind Code:
A1
Abstract:
The present invention provides a silicone composition that suppresses the precipitation of an insoluble function-imparting filling material and suppresses an increase in viscosity. Provided is a silicone composition that includes liquid silicone, an insoluble function-imparting filling material such as a thermally conductive filling material or an electrically conductive filling material, and a thickening-inhibiting precipitation prevention material or non-thickening precipitation prevention material such as a non-liquid cellulose compound or a polysaccharide. In a system that includes liquid silicone and an insoluble function-imparting filling material, the polysaccharide functions not as a thickening agent but as a thickening-inhibiting precipitation prevention material or a non-thickening precipitation prevention material, making it possible to obtain a silicone composition having low viscosity and being filled with a large quantity of a filling material.

Inventors:
WATANABE YASUYOSHI (JP)
KITADA GAKU (JP)
Application Number:
PCT/JP2014/084417
Publication Date:
June 30, 2016
Filing Date:
December 25, 2014
Export Citation:
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Assignee:
POLYMATECH JAPAN CO LTD (JP)
International Classes:
C08K3/22; C08L83/04; C08K3/36; C08L1/02; C08L3/02; C08L93/00
Foreign References:
JP2005255968A2005-09-22
JP2014502648A2014-02-03
JPH0959125A1997-03-04
JP2000072646A2000-03-07
JP2004091743A2004-03-25
JP2009286855A2009-12-10
JP2011140566A2011-07-21
JP2012007057A2012-01-12
JP2014105283A2014-06-09
Attorney, Agent or Firm:
OHTAKE, Seigo (JP)
Shogo Otake (JP)
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