Title:
SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/181713
Kind Code:
A1
Abstract:
This silicone composition contains (A) an organopolysiloxane which has at least two aliphatic unsaturated hydrocarbon groups per molecule and has a kinematic viscosity at 25ºC of 60-100,000 mm2/s, (B) an organohydrogenpolysiloxane represented by general formula (1) (R1 is an alkyl group having 1-6 carbon atoms, R2 is R1 or a hydrogen atom, n is an integer between 2 and 40, m is an integer between 0 and 98, and the value of n+m is such that 5 ≤ n+m ≤ 100.), (C) a flaky graphite powder having an average thickness of 100 nm or less, (D) a thermally conductive filler having a thermal conductivity of 10 W/m·ºC or more, (E) a platinum group metal catalyst and (G) a slightly volatile isoparaffin compound which has a boiling point of 160-360°C and which can disperse or dissolve the component (A) and the component (B). This silicone composition can give a silicone grease having a higher thermal conductivity and better handleability than conventional silicone greases.
Inventors:
TOYA WATARU (JP)
Application Number:
PCT/JP2019/010477
Publication Date:
September 26, 2019
Filing Date:
March 14, 2019
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/04; C08K5/01; C08L83/05
Domestic Patent References:
| WO2017208341A1 | 2017-12-07 | |||
| WO2016038836A1 | 2016-03-17 | |||
| WO2016190258A1 | 2016-12-01 |
Foreign References:
| JP2010150399A | 2010-07-08 | |||
| JP2013538494A | 2013-10-10 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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