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Title:
SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/133794
Kind Code:
A1
Abstract:
A silicone composition comprising (A) an electrically conductive filler, (B) a polydiorganosiloxane polymer, (C) a polyorganohydrogensiloxane, (D) a hydrosilylation reaction catalyst, (E) a polymer additive, and optionally (F) a hydrosilylation reaction inhibitor has a low complex viscosity upon admixing and upon cure provides a high electrical conductivity and good electrical conductivity retention after heat aging.

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Inventors:
CHEN WENJIE (CN)
XU YIFAN (CN)
REN HUA (CN)
SU FENGYI (CN)
SOOTSMAN JOSEPH RONALD (US)
Application Number:
PCT/CN2020/138587
Publication Date:
June 30, 2022
Filing Date:
December 23, 2020
Export Citation:
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Assignee:
DOW GLOBAL TECHNOLOGIES LLC (US)
DOW SILICONES CORP (US)
CHEN WENJIE (CN)
XU YIFAN (CN)
REN HUA (CN)
SU FENGYI (CN)
SOOTSMAN JOSEPH RONALD (US)
International Classes:
C08K3/08; C08L83/04; C09D5/24; C09J183/04; H01B1/20
Foreign References:
EP0971367A12000-01-12
US20030107026A12003-06-12
US3159601A1964-12-01
US3220972A1965-11-30
US2676182A1954-04-20
US9593209B22017-03-14
Other References:
J. HERZBERGER ET AL.: "Polymerization of ethylene oxide, propylene oxide, and other alkylene oxides: synthesis, novel polymer architectures, and bioconjugation", CHEMICAL REVIEWS, vol. 116, 2016, pages 2170 - 2243, XP055266674, DOI: 10.1021/acs.chemrev.5b00441
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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