Title:
SILICONE GEL COMPOSITION, AND SILICONE GEL CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2015/056374
Kind Code:
A1
Abstract:
The present invention provides a silicone gel composition which includes: 100 parts by mass of an organopolysiloxane (A) which is represent by general formula (1), namely RaR1
bSiO(4-a-b)/2, and which has, in each molecule thereof, at least 1 alkenyl group bonded to a silicon atom; an amount of an organohydrogenpolysiloxane (B) which is represented by general formula (2), namely R2
cHdSiO(4-c-d)/2, and which has, in each molecule thereof, at least two hydrogen atoms bonded to a silicon atom, said amount being an amount at which the number of hydrogen atoms bonded to the silicon atoms is 0.6-3 per every alkenyl group bonded to a silicon atom in component (A); an effective amount of a platinum-based catalyst (C); and 0.01-3 parts by mass of carbon nanotubes (D). As a result, provided is a silicone gel composition which, when cured, becomes a silicone gel cured product exhibiting a low elastic modulus, low stress, and excellent heat resistance at 230˚C.
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Inventors:
IKENO MASAYUKI (JP)
SATO KAZUYASU (JP)
SATO KAZUYASU (JP)
Application Number:
PCT/JP2014/003968
Publication Date:
April 23, 2015
Filing Date:
July 29, 2014
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08G77/04; C08K3/08; C08K7/06; C08L83/05; H01L23/29; H01L23/31
Foreign References:
| JP2007126576A | 2007-05-24 | |||
| JP2010037537A | 2010-02-18 | |||
| JP2012251116A | 2012-12-20 | |||
| JP2005206761A | 2005-08-04 | |||
| JP2010174084A | 2010-08-12 | |||
| JPH02269771A | 1990-11-05 | |||
| JP2002322364A | 2002-11-08 | |||
| JP2008291148A | 2008-12-04 |
Other References:
See also references of EP 3059286A4
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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