Title:
SILICONE MOLD
Document Type and Number:
WIPO Patent Application WO/2018/179842
Kind Code:
A1
Abstract:
Provided is a silicone mold capable of accurately molding a curable composition containing an epoxy resin even when repeatedly used. This silicone mold is to be used to mold a curable composition containing an epoxy resin, comprises a cured silicone resin composition article, and is characterized in that said cured article exhibits a 400nm wavelength light transmittance through a thickness of 1mm of 80% or higher, a breaking point elongation (according to JIS K 7161) of 250% or less, and a coefficient of linear thermal expansion of 350ppm/°C or less at 20-40°C.
Inventors:
FUJIKAWA TAKESHI (JP)
FUKUI SADAYUKI (JP)
FUKUI SADAYUKI (JP)
Application Number:
PCT/JP2018/003846
Publication Date:
October 04, 2018
Filing Date:
February 05, 2018
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
B29C33/40; G02B1/04; G02B3/00; B29L11/00
Domestic Patent References:
WO2014119514A1 | 2014-08-07 |
Foreign References:
JP2017036421A | 2017-02-16 | |||
JP2017060304A | 2017-03-23 | |||
JP2010045092A | 2010-02-25 |
Other References:
See also references of EP 3603922A4
Attorney, Agent or Firm:
GOTO & CO. (JP)
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