Title:
SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, SILICONE PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE FILM, IMAGE DISPLAY DEVICE, AND METHOD FOR EVALUATING SILICONE PRESSURE-SENSITIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/195268
Kind Code:
A1
Abstract:
The present invention is a silicone pressure-sensitive adhesive composition that contains: (A) an organopolysiloxane which is represented by average formula (1) and in which the content of silicon atom-bonded alkenyl groups is 0.0010-0.010 mol/100 g; (B) an organohydrogenpolysiloxane which is represented by average formula (2) and in which the content of silicon atom-bonded hydrogen atoms is 0.0010-0.020 mol/g; (C) an organopolysiloxane having (R3 3SiO1/2) units and (SiO4/2) units; (D) a hydrosilylation reaction catalyst; and (E) an antioxidant. Due to this configuration, it is possible to provide a pressure-sensitive adhesive which exhibits both high adhesive strength and excellent release properties, undergoes little coloration, and exhibits high transparency. (In the formula, R1 is a monovalent hydrocarbon group, and n is a number between 3000 and 15,000) (In the formula, R2 is a monovalent hydrocarbon group or a hydrogen atom, and m is a number between 0 and 200)
Inventors:
UCHIDA SEIYA (JP)
Application Number:
PCT/JP2023/007158
Publication Date:
October 12, 2023
Filing Date:
February 27, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09J183/07; C09J7/38; C09J11/06; C09J183/05; G01N33/00
Foreign References:
| JP2011102336A | 2011-05-26 | |||
| CN109306259A | 2019-02-05 | |||
| JP2019089913A | 2019-06-13 | |||
| JP2006016555A | 2006-01-19 | |||
| JP2021123628A | 2021-08-30 | |||
| JP2008024777A | 2008-02-07 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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