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Patent Searching and Data


Title:
SILICONE RESIN COMPOSITION, WAVELENGTH CONVERSION MATERIAL-CONTAINING SILICONE RESIN COMPOSITION, AND WAVELENGTH CONVERSION MATERIAL-CONTAINING SHEET
Document Type and Number:
WIPO Patent Application WO/2018/047756
Kind Code:
A1
Abstract:
Provided is a silicone resin composition which has favorable coating performance, and after being cured, exhibits excellent heat resistance as a cured article. A silicone resin composition containing a silicone resin and a solvent, wherein: the silicone resin composition is a liquid composition having a viscosity of 100-50,000 mPa∙s at 25°C; the silicone resin includes a structural unit represented by formula (A3); and the total content of a structural unit represented by formula (A1) and contained in the silicone resin, a structural unit represented by formula (A1') and contained therein, a structural unit represented by formula (A2) and contained therein, and a structural unit represented by formula (A3) and contained therein constitute 80 mol% or more of the total content of all structural units contained in the silicone resin. [In the formula, R1 represents an alkyl group or an aryl group. R2 represents an alkoxy group or a hydroxyl group.]

Inventors:
MASUI KENTARO (JP)
DOI ATSUNORI (JP)
Application Number:
PCT/JP2017/031728
Publication Date:
March 15, 2018
Filing Date:
September 04, 2017
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L83/04; C08G77/50; C08L83/06; G02B5/20
Domestic Patent References:
WO2016017592A12016-02-04
WO2007125785A12007-11-08
Foreign References:
JP2013159776A2013-08-19
JP2013124324A2013-06-24
JP2010132726A2010-06-17
JP2009173694A2009-08-06
JP2013001792A2013-01-07
JP2013095849A2013-05-20
Other References:
See also references of EP 3511377A4
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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