Title:
SILICONE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/089957
Kind Code:
A1
Abstract:
Provided is a silicone resin composition that retains flowability even at high levels of filling with a thermally conductive filler, and that provides suppression of oil bleed during use. This silicone resin composition comprises: as a component (A), an organopolysiloxane that is represented by formula (1) and has a molecular weight distribution (Mw/Mn) of not more than 1.30; and, as a component (B), a thermally conductive filler. (In formula (1), each R1 is independently a monovalent saturated hydrocarbon group or a monovalent aromatic hydrocarbon group, each R2 is independently a monovalent saturated hydrocarbon group, X is oxygen or a divalent hydrocarbon group, n is an integer equal to or greater than 1, and a is an integer from 1-3.)
Inventors:
KANNO YUUTO (JP)
KOSUGI MISA (JP)
TANAKA SHUGO (JP)
KOSUGI MISA (JP)
TANAKA SHUGO (JP)
Application Number:
PCT/JP2023/026718
Publication Date:
May 02, 2024
Filing Date:
July 21, 2023
Export Citation:
Assignee:
JNC CORP (JP)
International Classes:
C08L83/07; C08G77/20; C08K3/013
Foreign References:
| JP2020158547A | 2020-10-01 | |||
| JP2012007057A | 2012-01-12 | |||
| JP2006169411A | 2006-06-29 | |||
| JP2011219664A | 2011-11-04 |
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