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Title:
SILICONE RESIN CURED FILM AND METHOD FOR PRODUCING SILICONE RESIN CURED FILM
Document Type and Number:
WIPO Patent Application WO/2019/208609
Kind Code:
A1
Abstract:
The present invention provides: a production method with which it is possible to obtain, from a silicone resin composition, a silicone resin cured film that can be applied without repelling liquid, and experiences no breaking or cracking; and a silicone resin cured film. Provided is a silicone resin cured film having a surface in which the water contact angle is 72.0-90.0°. Also provided is a method for producing a silicone resin cured film, the method having an application step for applying a silicone resin composition to a base material, and a curing step for curing the silicone resin contained in the silicone resin composition, wherein the water contact angle of the surface of the base material to which the silicone resin composition is applied is 55.0-105.0°.

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Inventors:
IWAWAKI HIROSHI (JP)
MASUI KENTARO (JP)
YAMASHITA YASUHIRO (JP)
Application Number:
PCT/JP2019/017343
Publication Date:
October 31, 2019
Filing Date:
April 24, 2019
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08J5/18; B32B27/00; C08J7/046; C08J7/048; C08L83/06; C08G77/04
Foreign References:
JPH09110985A1997-04-28
JP2016011318A2016-01-21
JP2011152691A2011-08-11
JPH11263860A1999-09-28
JP2002282700A2002-10-02
JPH111661A1999-01-06
JP2008241882A2008-10-09
JP2012045795A2012-03-08
JP2004142161A2004-05-20
JP2017533292A2017-11-09
Other References:
ABE YOSHIMOTO: "Preparation and properties of polysilsesquioxanes Function and characterization of coating agents and films,", JOURNAL OF NON-CRYSTALLINE SOLIDS, vol. 261, January 2000 (2000-01-01), pages 39 - 51, XP004253748
ABE Y. ET AL.: "Preparation and properties of flexible films by acid-catalyzed hydrolytic polycondensation of Methyltrimethoxysilane", JOURNAL OF POLYMER SCIENCE : PART A: POLYMER CHEMISTRY, vol. 33, March 1995 (1995-03-01), pages 751 - 754, XP055652733
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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