Title:
SILVER ALLOY COMPOSITION FOR FORMING CONDUCTIVE FILM AND METHOD FOR PREPARING SAME
Document Type and Number:
WIPO Patent Application WO/2018/084467
Kind Code:
A1
Abstract:
The present invention relates to a silver alloy composition. The present invention provides, as an example, a silver alloy composition comprising 0.01-5.0 wt% of at least one element of indium (In), magnesium (Mg), copper (Cu), gallium (Ga), and tantalum (Ta), oxygen of 20 ppm or more but less than 100 ppm, and the balance silver (Ag) and inevitable impurities.
Inventors:
KIM DONG-WOOK (KR)
HONG GIL-SOO (KR)
PARK JOO-HYEON (KR)
HONG GIL-SOO (KR)
PARK JOO-HYEON (KR)
Application Number:
PCT/KR2017/011541
Publication Date:
May 11, 2018
Filing Date:
October 18, 2017
Export Citation:
Assignee:
HEE SUNG METAL LTD (KR)
International Classes:
C22C5/06; B22D18/02; C22F1/14; C23C14/14; H01L31/0392; H01L31/0445; H01L51/52
Foreign References:
| JP2015038238A | 2015-02-26 | |||
| JP2015199996A | 2015-11-12 | |||
| KR20140134727A | 2014-11-24 | |||
| JP2005100604A | 2005-04-14 | |||
| JPH073363A | 1995-01-06 |
Attorney, Agent or Firm:
C.M. PATENT & LAW FIRM. LLP (KR)
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