SILVER-BISMUTH POWDER, CONDUCTIVE PASTE AND CONDUCTIVE FILM

WIPO Patent Application WO/2014/174984

A1

A silver-bismuth powder which comprises silver and bismuth at a mass ratio of silver to bismuth of 95:5 to 40:60 and which exhibits a particle diameter (D50) of 0.1 to 10μm in the volume-based particle size distribution obtained by a laser diffraction method for particle size analysis and an oxygen content of 5.5 mass% or less, said particle diameter (D50) being a particle diameter at a cumulative volume of 50%.

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OGI KOZO (JP)
INOUE KENICHI (JP)
EBARA ATSUSHI (JP)
ASANO AKIHIRO (JP)
FUJIMOTO HIDEYUKI (JP)
YAMADA TAKAHIRO (JP)

PCT/JP2014/059016

October 30, 2014

March 27, 2014

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DOWA ELECTRONICS MATERIALS CO (JP)

B22F1/052; B22F7/04; B22F9/08; C22C5/06; C22C12/00; H01B1/00; H01B1/22; H01B5/00; H01B5/14; H05K1/09

JP2012125791A	2012-07-05
JP2010123681A	2010-06-03
JP2011036901A	2011-02-24
JP2013014790A	2013-01-24
JP2008227204A	2008-09-25

HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)

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