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Title:
SILVER-COATED COPPER POWDER AND METHOD FOR PRODUCING SAME, SILVER-COATED COPPER POWDER-CONTAINING CONDUCTIVE PASTE, CONDUCTIVE ADHESIVE AGENT, CONDUCTIVE FILM, AND ELECTRIC CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2012/133627
Kind Code:
A1
Abstract:
The present invention provides a silver-coated copper powder exhibiting excellent conductivity and migration resistance and a method for producing the same, and a conductive paste, conductive adhesive agent, conductive film and electric circuit containing the silver-coated copper powder. A method for producing a silver-coated copper powder in which a copper powder and a silver fine-particle powder are mixed and stirred and the silver fine-particle powder is adhered to the particle surfaces of the copper powder; wherein a silver-coated copper powder exhibiting excellent conductivity and migration resistance can be obtained by carrying out all the treatment processes as dry processes, and by using, as the silver fine-particle powder, silver fine-particle powder in which the particle surfaces have been surface coated with a dispersing agent.

Inventors:
IWASAKI KEISUKE (JP)
OHSUGI MINEKO (JP)
MORII HIROKO (JP)
HAYASHI KAZUYUKI (JP)
Application Number:
PCT/JP2012/058327
Publication Date:
October 04, 2012
Filing Date:
March 29, 2012
Export Citation:
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Assignee:
TODA KOGYO CORP (JP)
IWASAKI KEISUKE (JP)
OHSUGI MINEKO (JP)
MORII HIROKO (JP)
HAYASHI KAZUYUKI (JP)
International Classes:
B22F1/17; H01B1/22; H01B5/00; H01B5/14; H01B13/00; B22F1/08
Domestic Patent References:
WO2007040195A12007-04-12
WO2005031760A12005-04-07
Foreign References:
JPS6167702A1986-04-07
JP2005044798A2005-02-17
JPS59146103A1984-08-21
Attorney, Agent or Firm:
OKADA, KAZUHIKO (JP)
Kazuhiko Okada (JP)
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