Title:
SILVER-COATED COPPER POWDER AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/135138
Kind Code:
A1
Abstract:
Provided are: a silver-coated copper powder which, when used in a conductive paste for forming a bus bar electrode of a solar cell, enables production of a solar cell that improves the conversion efficiency of the solar cell as compared to conventional silver-coated copper powders so as to achieve a high conversion efficiency equivalent to that achieved by the use of silver powder; and a method for producing the silver-coated copper powder. A silver-coated copper powder, obtained by coating the surface of a copper powder prepared by an atomization method or the like with a silver-containing layer comprising at least 5 mass% (with respect to the silver-coated copper powder) of silver or a silver compound, is added to a cyanogen compound solution, such as a potassium silver cyanide solution, a potassium gold cyanide solution, a potassium cyanide solution, or a sodium cyanide solution, so that 3-3000 ppm of cyanide is included in the copper powder coated with the silver-containing layer.
Inventors:
KAMIGA HIROSHI (JP)
NOGAMI NORIAKI (JP)
HIRATA AIKO (JP)
NOGAMI NORIAKI (JP)
HIRATA AIKO (JP)
Application Number:
PCT/JP2017/002676
Publication Date:
August 10, 2017
Filing Date:
January 26, 2017
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F1/00; B22F1/16; B22F9/00; H01B1/00; H01B1/22; H01B5/00; H01B13/00; H01L31/0224
Foreign References:
| JPH0762274A | 1995-03-07 | |||
| JP2002157918A | 2002-05-31 | |||
| JP2007073545A | 2007-03-22 | |||
| JP2016130365A | 2016-07-21 |
Attorney, Agent or Firm:
OKAWA Koichi (JP)
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