SILVER-COATED COPPER POWDER AND PRODUCTION METHOD FOR SAME

Title:

SILVER-COATED COPPER POWDER AND PRODUCTION METHOD FOR SAME

Document Type and Number:

WIPO Patent Application WO/2016/031210

Kind Code:

A1

Abstract:

Provided are a silver-coated copper powder that has excellent storage stability (reliability) and a production method therefor. In the present invention, a silver-coated copper powder is obtained by covering the surface of a copper powder that is obtained by atomization or the like with a silver-containing layer that comprises 5 mass% or more (with respect to the silver-coated copper powder) of silver or a silver compound. The silver-coated copper powder is added to a gold-plating liquid that comprises a potassium gold cyanide solution (to which has ideally been added at least one of tripotassium citrate monohydrate, anhydrous citric acid, and L-aspartic acid), and the surface of the copper powder that has been coated with the silver-containing layer is thereby loaded with 0.01 mass% or more (with respect to the silver-coated copper powder) of gold.

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Inventors:

NOGAMI NORIAKI (JP)
KAMIGA HIROSHI (JP)

Application Number:

PCT/JP2015/004197

Publication Date:

March 03, 2016

Filing Date:

August 21, 2015

Export Citation:

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Assignee:

DOWA ELECTRONICS MATERIALS CO (JP)

International Classes:

B22F1/052; B22F1/10; B22F1/17; B22F9/24

Foreign References:

JP2014510192A	2014-04-24
JP2004323962A	2004-11-18
JP2011028985A	2011-02-10
JP2014105387A	2014-06-09
JP2014005531A	2014-01-16