Title:
SILVER-CONTAINING COMPOSITION AND SILVER COMPONENT FORMING BASE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/010549
Kind Code:
A1
Abstract:
Provided are a silver-containing composition exhibiting high storage stability and a silver component forming base material using the composition, according to which a silver component such as a metal silver film or wire which exhibits excellent conductivity and adhesion can be obtained by sintering at a low temperature of 120°C or below for a short amount of time or sintering at 150°C or higher for an extremely short amount of time. The composition of the present invention comprises a silver compound (A) represented by formula (1), an amine compound (B) represented by formula (2) and a silane coupling agent (C), where the silver compound (A), the amine compound (B) and the silane coupling agent (C) are included at a specific ratio. (R1: hydrogen, -(CY1Y2)a-CH3, or ((CH2)b-O-CHZ)c-CH3, R2: -(CY1Y2)d-CH3, -((CH2)e-O-CHZ)f-CH3, Y1, Y2: hydrogen or -(CH2)g-CH3, Z: hydrogen or -(CH2)h-CH3, a: 0 to 8, b: 1 to 4, c: 1 to 3, d: 0 to 8, e: 1 to 4, f: 1 to 3, g: 0 to 3, h: 0 to 2).
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Inventors:
NAKAMURA HISASHI (JP)
TAGUCHI HIROYUKI (JP)
TAKAHASHI SHUICHI (JP)
TAGUCHI HIROYUKI (JP)
TAKAHASHI SHUICHI (JP)
Application Number:
PCT/JP2013/068631
Publication Date:
January 16, 2014
Filing Date:
July 08, 2013
Export Citation:
Assignee:
NOF CORP (JP)
International Classes:
H01B1/22; C09D1/00; C09D5/24; C09D11/00; H01B5/14
Foreign References:
| JP2012153634A | 2012-08-16 | |||
| JP2009114232A | 2009-05-28 |
Attorney, Agent or Firm:
SAKAI Hajime et al. (JP)
Sakai 1 (JP)
Sakai 1 (JP)
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