SILVER FINE POWDER, METHOD FOR PRODUCING THE SAME, AND INK

WIPO Patent Application WO/2008/084866

A1

Disclosed is a silver fine powder composed of silver particles having an average particle diameter of not more than 20 nm, each of which particles has an organic protection material on the surface. The presence ratio of the organic protection material to the total of the silver particle and the organic protection material is 0.05-25% by mass. An amine compound having a molecular weight of 100-1000 is suitably used for the organic protection material, and such a compound having one or more unsaturated bonds in a molecule is particularly suitable. In this silver fine powder, the crystallite diameter on the (111) crystal face of the silver particle is not more than 20 nm. Also disclosed is an ink having a viscosity of not more than 50 mPa.s, which is obtained by dispersing the silver powder in an organic solvent so that the silver concentration is not less than 10% by mass.

SATO, Kimitaka (14-1, Sotokanda 4-chome,Chiyoda-k, Tokyo 21, 1010021, JP)
佐藤 王高 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 1010021, JP)

JP2008/050308

July 17, 2008

January 08, 2008

Click for automatic bibliography generation  

DOWA ELECTRONICS MATERIALS CO., LTD. (14-1, Sotokanda 4-chomeChiyoda-k, Tokyo 21, 1010021, JP)
ＤＯＷＡエレクトロニクス株式会社 (〒21 東京都千代田区外神田四丁目１４番１号 Tokyo, 1010021, JP)
SATO, Kimitaka (14-1, Sotokanda 4-chome,Chiyoda-k, Tokyo 21, 1010021, JP)

B22F1/02; B22F9/24; C09D11/00; H01B1/22; H01B5/00; H01B13/00; H01L21/288

WADA, Kenji (Room 601, Lions Mansion Ichigaya8-10, Sumiyoshi-cho, Shinjuku-ku, Tokyo, 162-0065, JP)

View/Download PDF      PDF Help

Previous Patent: MATERIAL FOR TRANSPARENT CONDUCTIVE FILM

Next Patent: SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SEMICONDUCTOR DEVICE