Title:
SILVER HYBRID COPPER POWDER, METHOD FOR PRODUCING SAME, CONDUCTIVE PASTE CONTAINING SILVER HYBRID COPPER POWDER, CONDUCTIVE ADHESIVE, CONDUCTIVE FILM AND ELECTRICAL CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2014/054618
Kind Code:
A1
Abstract:
The present invention relates to a silver hybrid copper powder which is characterized in that: a fine silver particle powder adheres to the surface of a copper powder; the ratio of the average particle diameter (D50) of the copper powder to the average particle diameter (DSEM) of the fine silver particles, namely D50/DSEM is within the range of 3-400; and the tap density ratio of the copper powder to the fine silver particles is within the range of 0.5-1.5. The present invention also relates to: a method for producing the silver hybrid copper powder; a conductive paste which contains the silver hybrid copper powder; a conductive adhesive; a conductive film; and an electrical circuit. A silver hybrid copper powder of the present invention uses a copper powder and fine silver particles having specific average particle diameters and specific tap densities, and can be obtained by mixing and stirring the copper powder and fine silver particle powder, thereby having the fine silver particle powder adhere to the particle surfaces of the copper powder. This silver hybrid copper powder has excellent electrical conductivity and excellent migration resistance.
Inventors:
MORII HIROKO (JP)
IWASAKI KEISUKE (JP)
YAMAMOTO YOSUKE (JP)
OHSUGI MINEKO (JP)
HAYASHI KAZUYUKI (JP)
IWASAKI KEISUKE (JP)
YAMAMOTO YOSUKE (JP)
OHSUGI MINEKO (JP)
HAYASHI KAZUYUKI (JP)
Application Number:
PCT/JP2013/076664
Publication Date:
April 10, 2014
Filing Date:
October 01, 2013
Export Citation:
Assignee:
TODA KOGYO CORP (JP)
International Classes:
B22F1/054; B22F1/17; C09J9/02; C09J11/04; C09J201/00; H01B1/00; H01B1/22; H01B5/00; H01B5/14; H01B13/00; H05K1/09
Foreign References:
| JP2007100155A | 2007-04-19 | |||
| JPH04218602A | 1992-08-10 | |||
| JP2005015910A | 2005-01-20 |
Attorney, Agent or Firm:
OKADA, KAZUHIKO (JP)
Kazuhiko Okada (JP)
Kazuhiko Okada (JP)
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