Title:
SILVER MICROPARTICLE DISPERSION LIQUID
Document Type and Number:
WIPO Patent Application WO/2019/069936
Kind Code:
A1
Abstract:
The present disclosure pertains to a silver microparticle dispersion liquid containing (i) 60-95 mass% of silver microparticles having a particle diameter (D50) of 50-300 nm, (ii) 4.5-39 mass% of a solvent, and (iii) 0.1-3 mass% of a resin having a glass transition temperature (Tg) of 70-300°C (the mass fractions being based on the mass of the silver microparticle dispersion liquid).
Inventors:
TERAGAWA SHINGO (JP)
HINOTSU TAKASHI (JP)
HUI DAVE (GB)
WOLFE MICHAEL STEPHEN (US)
GLICKSMAN HOWARD DAVID (US)
YANG HAIXIN (US)
HINOTSU TAKASHI (JP)
HUI DAVE (GB)
WOLFE MICHAEL STEPHEN (US)
GLICKSMAN HOWARD DAVID (US)
YANG HAIXIN (US)
Application Number:
PCT/JP2018/036905
Publication Date:
April 11, 2019
Filing Date:
October 02, 2018
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F9/00; B22F1/0545; B22F9/24; H01B1/22
Domestic Patent References:
| WO2017033911A1 | 2017-03-02 |
Foreign References:
| US20140318618A1 | 2014-10-30 | |||
| JP2018060941A | 2018-04-12 | |||
| US20160297982A1 | 2016-10-13 |
Other References:
See also references of EP 3693109A4
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
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