SILVER MICROPARTICLE POWDER AND METHOD FOR PRODUCTION THEREOF

WIPO Patent Application WO/2008/038534

A1

Disclosed is a silver microparticle powder which has an organic protective film and also has such a board grain size distribution that a CV value as calculated in accordance with the formula (1) by employing the grain size measured by the observation on a TEM (a transmission electron microscope) is 40% or greater. The organic protective film may be composed of a fatty acid having a molecular weight of 100 to 1000 (e.g., oleic acid) and an amine compound having a molecular weight of 100 to 1000, wherein at least one of the fatty acid and the amine compound has one or more unsaturated bonds per molecule. CV value = 100 Œ [standard deviation ofgrain size σD]/[average grain diameter DTEM] (1)

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OGI, Kozo (14-1, Soto-kanda 4-chome, Chiyoda-k, Tokyo 21, 1010021, JP)
尾木 孝造 (〒21 東京都千代田区外神田４丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 1010021, JP)

JP2007/068026

April 03, 2008

September 11, 2007

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DOWA ELECTRONICS MATERIALS CO., LTD. (14-1, Soto-kanda 4-chome Chiyoda-k, Tokyo 21, 1010021, JP)
ＤＯＷＡエレクトロニクス株式会社 (〒21 東京都千代田区外神田４丁目１４番１号 Tokyo, 1010021, JP)
OGI, Kozo (14-1, Soto-kanda 4-chome, Chiyoda-k, Tokyo 21, 1010021, JP)

B22F1/02; B22F1/00; B22F9/24; H01B1/22; H01B5/00; H01B5/14; H01B13/00

WADA, Kenji (Room 601, Lions Mansion Ichigaya8-10, Sumiyoshi-cho, Shinjuku-ku, Tokyo 65, 1620065, JP)

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