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Title:
SILVER NANOWIRE INK AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/142904
Kind Code:
A1
Abstract:
[Problem] To provide a silver nanowire ink in which the amount of coarse foreign matter particles present is sufficiently minimized, wherein the silver nanowire ink is formulated using silver nanowires that are highly effective in improving the electrical conductivity of a transparent electroconductive film. [Solution] A silver nanowire ink intermediate product having dispersed therein silver nanowires, in which an organic protective agent is bonded to the surface thereof and in which the amount of the organic protective agent bonded is 1.5-8.0% by mass relative to the total amount of the organic protective agent and silver, is subjected to a dispersion process by a thin film rotation method, whereby the form of the silver nanowires in the ink is adjusted so that the number of bend parts in the wires measured with respect to a total wire length of 1.0 mm or greater is no more than 20.0 per mm in terms of unit length of the wires, and moreover is adjusted so that the number of particles present having a particle diameter exceeding 7 μm as measured by a light-shielding liquid particle counter is no more than 50 per mL in terms of unit volume of the ink.

Inventors:
SAITO HIROTOSHI (JP)
SATO KIMITAKA (JP)
Application Number:
PCT/JP2019/001435
Publication Date:
July 25, 2019
Filing Date:
January 18, 2019
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
H01B1/22; B22F1/0545; B22F1/102; B22F1/103; B22F1/107; B22F9/00; B82Y30/00; B82Y40/00; H01B1/00; H01B5/14; H01B13/00
Domestic Patent References:
WO2018003759A12018-01-04
WO2017209230A12017-12-07
Foreign References:
JP2014209573A2014-11-06
JP2015180772A2015-10-15
JP2016055283A2016-04-21
JP2018095962A2018-06-21
JP2016066590A2016-04-28
JP2016076241A2016-05-12
JP2014209573A2014-11-06
JP2015180772A2015-10-15
JP2016055283A2016-04-21
Attorney, Agent or Firm:
KOMATSU Takashi (JP)
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