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Title:
SILVER NANOWIRE INK, PROCESS FOR PRODUCING SAME, AND ELECTROCONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2018/003759
Kind Code:
A1
Abstract:
[Problem] To provide a silver nanowire ink which is less apt to form bundle-shaped wire agglomerates even when applied with a die coater, and is capable of stably forming transparent conductors that have satisfactory electroconductivity. [Solution] A silver nanowire ink which comprises silver nanowires coated with a copolymer of vinylpyrrolidone and a hydrophilic monomer and a liquid medium containing hydroxyethyl methyl cellulose (HEMC), the nanowires being dispersed in the liquid medium, wherein the content of the HEMC in the ink is 0.01-1.0 mass%.

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Inventors:
SATO KIMITAKA (JP)
SAITO HIROTOSHI (JP)
Application Number:
PCT/JP2017/023459
Publication Date:
January 04, 2018
Filing Date:
June 26, 2017
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
C09D11/037; B22F1/00; B22F1/16; B82Y30/00; B82Y40/00; C09D11/52; H01B1/00; H01B1/22; H01B13/00
Domestic Patent References:
WO2015133453A12015-09-11
WO2015008676A12015-01-22
Foreign References:
JP2010244747A2010-10-28
JP2013544917A2013-12-19
JP2015518063A2015-06-25
JP2001093414A2001-04-06
JP2015174922A2015-10-05
JP2015180772A2015-10-15
JP2009505358A2009-02-05
Other References:
See also references of EP 3527631A4
Attorney, Agent or Firm:
KOMATSU Takashi (JP)
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