Title:
SILVER PARTICLE COMPOSITE POWDER AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2008/038535
Kind Code:
A1
Abstract:
A silver particle composite powder obtained by mixing a silver particle powder (A) which bears on the surface of each silver particle an organic protecting layer composed of an amine having one or more unsaturated linkages in one molecule and a molecular weight of 100 to 1000 and has a mean particle diameter DTEM of 50nm or below as determined by TEM with a silver particle powder (B) which bears on the surface of each silver particle an organic protecting layer composed of both a fatty acid having a molecular weight of 100 to 1000 and an amine having a molecular weight of 100 to 1000 with at least either having one or more unsaturated linkages in one molecule and has a mean particle diameter DTEM of 50nm or below at an A:B mass ratio of 3:1 to 1:3 in terms of silver.
Inventors:
OGI, Kozo (14-1, Soto-kanda 4-chome, Chiyoda-k, Tokyo 21, 1010021, JP)
尾木 孝造 (〒21 東京都千代田区外神田４丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 1010021, JP)
尾木 孝造 (〒21 東京都千代田区外神田４丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 1010021, JP)
Application Number:
JP2007/068027
Publication Date:
April 03, 2008
Filing Date:
September 11, 2007
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO., LTD. (14-1, Soto-kanda 4-chome Chiyoda-k, Tokyo 21, 1010021, JP)
ＤＯＷＡエレクトロニクス株式会社 (〒21 東京都千代田区外神田４丁目１４番１号 Tokyo, 1010021, JP)
OGI, Kozo (14-1, Soto-kanda 4-chome, Chiyoda-k, Tokyo 21, 1010021, JP)
ＤＯＷＡエレクトロニクス株式会社 (〒21 東京都千代田区外神田４丁目１４番１号 Tokyo, 1010021, JP)
OGI, Kozo (14-1, Soto-kanda 4-chome, Chiyoda-k, Tokyo 21, 1010021, JP)
International Classes:
B22F1/02; B22F1/00; B22F9/24; C09C1/62; C09C3/08; C09D1/00; C09D5/24; H01B5/00; H01B13/00; H01L21/28; H01L21/288; H01B1/22
Attorney, Agent or Firm:
WADA, Kenji (Room 601, Lions Mansion Ichigaya8-10, Sumiyoshi-cho, Shinjuku-ku, Tokyo 65, 1620065, JP)
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