Title:
SILVER PARTICLE DISPERSION LIQUID, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING CONDUCTIVE FILM WITH USE OF SAID SILVER PARTICLE DISPERSION LIQUID
Document Type and Number:
WIPO Patent Application WO/2018/088339
Kind Code:
A1
Abstract:
Provided are: a low-cost silver particle dispersion liquid which is able to be used as a slurry for inkjet; a method for producing this silver particle dispersion liquid; and a method for producing a conductive film with use of this silver particle dispersion liquid. This silver particle dispersion liquid, which is composed of a silver powder and a solvent, is configured such that: a silver powder which has an average primary particle diameter (DSEM) of 0.15-0.5 μm and a ratio of the 50% cumulative particle diameter (D50) on the volume basis to the average primary particle diameter DSEM, namely D50/DSEM of 1.7 or more, and to the surface of which a fatty acid adheres is used as the silver powder; and a solvent which is mainly composed of a monohydric higher alcohol having 6-12 carbon atoms, butyl carbitol or butyl carbitol acetate is used as the solvent.
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Inventors:
OKANO TAKU (JP)
NOGAMI NORIAKI (JP)
NOGAMI NORIAKI (JP)
Application Number:
PCT/JP2017/039867
Publication Date:
May 17, 2018
Filing Date:
November 06, 2017
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F1/00; B22F1/0545; B22F1/102; B22F1/145; B22F9/00; C09D11/52; H01B1/00; H01B1/22; H01B13/00
Domestic Patent References:
| WO2016052362A1 | 2016-04-07 |
Attorney, Agent or Firm:
OKAWA Koichi (JP)
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