SILVER PARTICLES CONTAINING COPPER, METHOD FOR PRODUCING THE SAME, AND DISPERSION USING THE SAME

WIPO Patent Application WO/2010/073420

A1

Provided is a method suitable for the simple, mass production of nanoparticles having a uniform grain size, and silver particles produced by the same production method. One or more selected from the group consisting of copper, copper compounds, and copper ions is added prior to completion of the reduction reaction during the silver particle reaction in which a silver compound solution, protector, and reducing agent solution are mixed and reduction is performed.  As a result, regardless of the reaction scale, it is possible to produce particles having a uniform grain size by a reaction in which silver particles are obtained such that the average grain size in the solution is 1 to 100 nm.

JP2017110299	SILVER COATED COPPER POWDER PRODUCTION METHOD AND CONDUCTIVE PASTE PRODUCTION METHOD
JP5354041	Silver powder manufacturing method
JPH1068007	PRODUCTION OF FINE METALLIC GRAIN AND ATOMIZING DEVICE FOR PRODUCING FINE METALLIC GRAIN

KANEDA SHUJI (JP)
MOTOMURA KIMIKAZU (JP)
KARIYASU TATSUYA (JP)
HISAEDA YUTAKA (JP)
IHA KOSUKE (JP)

PCT/JP2009/002873

July 01, 2010

June 23, 2009

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DOWA ELECTRONICS MATERIALS CO (JP)
KANEDA SHUJI (JP)
MOTOMURA KIMIKAZU (JP)
KARIYASU TATSUYA (JP)
HISAEDA YUTAKA (JP)
IHA KOSUKE (JP)

B22F9/24; B22F1/0545

JP2006111903A	2006-04-27
JP2007291513A	2007-11-08
JPH05156326A	1993-06-22

HIROKOH, MASAKI (JP)
Hiroyuki right tree (JP)

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