Title:
SILVER PARTICLES
Document Type and Number:
WIPO Patent Application WO/2021/044817
Kind Code:
A1
Abstract:
Provided are new silver particles with which, when the silver particles are made into an electrically conductive adhesive, sintering is suitably performed at a low temperature without pressure application during sintering of the electrically conductive adhesive, and thus a sintered body having a high degree of minuteness and high mechanical strength (shear strength) is formed. The silver particles include silver particles A having an average particle size of 50-500 nm and silver particles B having an average particle size of 0.5-5.5 µm, and satisfy a relationship in which the average particle size of the silver particles B is 5-11 fold of the average particle size of the silver particles A.
Inventors:
OKUDA MASATOSHI (JP)
MORI TAKAMICHI (JP)
MINAMI JUNICHIRO (JP)
IWASA NARUHITO (JP)
MORI TAKAMICHI (JP)
MINAMI JUNICHIRO (JP)
IWASA NARUHITO (JP)
Application Number:
PCT/JP2020/030725
Publication Date:
March 11, 2021
Filing Date:
August 12, 2020
Export Citation:
Assignee:
OSAKA SODA CO LTD (JP)
International Classes:
B22F1/00; B22F1/102; B22F7/08; H01B1/00; H01B1/22; H01B5/00; H01L21/52
Domestic Patent References:
| WO2015163076A1 | 2015-10-29 | |||
| WO2015194536A1 | 2015-12-23 | |||
| WO2010018712A1 | 2010-02-18 |
Foreign References:
| JP2007018884A | 2007-01-25 | |||
| JP2015159096A | 2015-09-03 | |||
| JP5574761B2 | 2014-08-20 |
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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