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Title:
SILVER PASTE COMPOSITION AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/038611
Kind Code:
A1
Abstract:
Provided are: a silver paste composition which is capable of suppressing increase in electrical resistance and viscosity, and is capable of decreasing the electrical resistivity; and a method for producing the silver paste composition. A silver paste composition that contains (A) silver particles, each of which is a spherical porous body having open communicating pores, (B) a resin and/or (C) a dispersant. This silver paste composition preferably contains at least one substance that is selected from among (D) a curing agent, (E) a flux agent and (F) a curing accelerator. A method for producing this silver paste composition.

Inventors:
TAKAHASHI TOMOYUKI (JP)
SAKAI NORIYUKI (JP)
YOSHII AKITO (JP)
Application Number:
PCT/JP2013/073874
Publication Date:
March 13, 2014
Filing Date:
September 05, 2013
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
C08L101/00; B22F1/05; B22F1/065; B22F1/10; B22F9/24; C08K3/08; H01B1/00; H01B1/22; H01B5/14; H01B13/00; H05K1/09
Domestic Patent References:
WO2012063747A12012-05-18
Foreign References:
JP2003335924A2003-11-28
JP2006183092A2006-07-13
JP2006193795A2006-07-27
JP2006097086A2006-04-13
JP2006002228A2006-01-05
JP2001107101A2001-04-17
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)
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