SILVER PASTE, AND CONDUCTIVE MOLDED ARTICLE OBTAINED USING SAME

Title:

SILVER PASTE, AND CONDUCTIVE MOLDED ARTICLE OBTAINED USING SAME

Document Type and Number:

WIPO Patent Application WO/2016/093223

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a silver paste capable of forming a conductive silver coating film that exhibits substantially the same resistivity as the resistance value of bulk silver, without variations in the resistivity, during low-temperature firing. The problem is solved by providing a silver paste that includes: an aqueous silver nanoparticle dispersion obtained using a compound having a polyethyleneimine skeleton as a protectant; a compound having a functional group capable of reacting with the nitrogen atoms in the polyethyleneimine; and at least one compound selected from the group consisting of compounds having an amine functional group and compounds having an amide functional group.

Inventors:

KAWAMURA KAORI (JP)
MORIWAKI MASAYUKI (JP)
SANO YOSHIYUKI (JP)

Application Number:

PCT/JP2015/084381

Publication Date:

June 16, 2016

Filing Date:

December 08, 2015

Export Citation:

Click for automatic bibliography generation Help

Assignee:

DAINIPPON INK & CHEMICALS (JP)

International Classes:

H01B1/22; B22F1/054; B22F1/0545; B22F1/10; B22F1/102; B22F1/103; B22F9/00; C08K3/08; C08K3/24; C08K5/16; C08L79/02; C09D5/24; C09D7/12; C09D163/00; C09D171/02; C09D179/02; H01B5/16; B22F9/20

Domestic Patent References:

WO2009157309A1	2009-12-30
WO2008143061A1	2008-11-27
WO2011078141A1	2011-06-30
WO2011078140A1	2011-06-30

Foreign References:

JP2008037884A	2008-02-21
JP2008038180A	2008-02-21

Other References: