Title:
SILVER PASTE AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/060173
Kind Code:
A1
Abstract:
The present invention provides a silver past that contains: tabular silver particles that have a center-line average surface roughness (Ra) of 1 nm or less; silver particles that have a center-line average surface roughness (Ra) of 2-20 nm and that have a particle diameter of 1-20 μm; and a solvent.
Inventors:
ISHIKAWA DAI (JP)
KAWANA YUKI (JP)
MATSUMOTO HIROSHI (JP)
NATORI MICHIKO (JP)
NAKAKO HIDEO (JP)
TANAKA TOSHIAKI (JP)
KAWANA YUKI (JP)
MATSUMOTO HIROSHI (JP)
NATORI MICHIKO (JP)
NAKAKO HIDEO (JP)
TANAKA TOSHIAKI (JP)
Application Number:
PCT/JP2014/077441
Publication Date:
April 30, 2015
Filing Date:
October 15, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B22F1/10; B22F1/105; H01B1/00; H01B1/22; H01L21/52
Domestic Patent References:
| WO2012086588A1 | 2012-06-28 |
Foreign References:
| JP2004169039A | 2004-06-17 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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