Title:
SILVER PASTE AND SEMICONDUCTOR DEVICE USING SAME, AND PRODUCTION METHOD FOR SILVER PASTE
Document Type and Number:
WIPO Patent Application WO/2015/060245
Kind Code:
A1
Abstract:
The present invention provides a silver paste that is a silver paste that contains silver particles and a solvent. The silver particles contain silver particles that have a particle diameter of 1-20 μm and silver particles that have a particle diameter of 1-300 nm and that are covered by a protective agent that has a boiling point of less than 130℃ at atmospheric pressure.
Inventors:
ISHIKAWA DAI (JP)
MATSUMOTO HIROSHI (JP)
NATORI MICHIKO (JP)
NAKAKO HIDEO (JP)
TANAKA TOSHIAKI (JP)
MATSUMOTO HIROSHI (JP)
NATORI MICHIKO (JP)
NAKAKO HIDEO (JP)
TANAKA TOSHIAKI (JP)
Application Number:
PCT/JP2014/077830
Publication Date:
April 30, 2015
Filing Date:
October 20, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B22F1/054; B22F1/10; B22F1/102; H01B1/00; H01B1/22; H01B13/00; H01L21/52; H05K3/12
Domestic Patent References:
| WO2002035554A1 | 2002-05-02 |
Foreign References:
| JP2012052198A | 2012-03-15 | |||
| JP2008091250A | 2008-04-17 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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