SILVER PASTE - SHOEI CHEMICAL IND CO

Title:

SILVER PASTE

Document Type and Number:

WIPO Patent Application WO/2020/137330

Kind Code:

A1

Abstract:

Provided is a silver paste containing at least a silver powder, a binder resin, and an organic solvent, said silver paste characterized in that: the content CAG of the silver powder relative to the silver paste is 80.00-97.00 mass%; in a particle size distribution measurement of the silver powder using laser diffraction where D10 and D50 are volume-based cumulative fractions of 10% and 50%, respectively, D10 is 1.00-3.00 μm and D50 is 3.00-7.00 μm; the specific surface area SBET of the silver powder is 0.10-0.30 m2/g; the copper content of the silver powder is 10-5000 mass ppm; the content CBND of the binder resin relative to the silver powder is 0.430-0.750 mass%; and the dry film density of the silver paste is at least 7.50 g/cm3.　The present invention makes it possible to provide a silver paste containing a high concentration of powder and having excellent printability, and thus provide a silver conductive film exhibiting a high fill factor and film density, displaying high conductivity, and having excellent migration resistance.

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Inventors:

NISHIMURA KOUSUKE (JP)
SHINDO NAOTO (JP)
MASHIMA HIROSHI (JP)

Application Number:

PCT/JP2019/046481

Publication Date:

July 02, 2020

Filing Date:

November 28, 2019

Export Citation:

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Assignee:

SHOEI CHEMICAL IND CO (JP)

International Classes:

B22F1/00; B22F1/06; B22F1/102; B22F1/103; C22C5/08; H01B1/00; H01B1/02; H01B1/22

Foreign References:

JP2011021271A	2011-02-03
JP2018055819A	2018-04-05
JP2018123427A	2018-08-09