Title:
SILVER-PLATED MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/148201
Kind Code:
A1
Abstract:
Provided is a silver-plated material with excellent bending workability which comprises a foundation layer consisting of nickel and formed on a base material and which comprises a surface layer consisting of silver and formed on the surface of said foundation layer. In this silver-plated material which comprises a foundation layer consisting of nickel and formed on the base material consisting of copper or a copper alloy and which comprises a 10μm or thinner surface layer consisting of silver and formed on the surface of said foundation layer, the thickness of the foundation layer is set to 2μm or less, and preferably to 1.5μm or less, and the area fraction of the {200} orientation of the surface layer is set to 15% or greater, and preferably to 25% or greater.
Inventors:
SHINOHARA KEISUKE (JP)
OGATA MASAFUMI (JP)
MIYAZAWA HIROSHI (JP)
SUGAWARA AKIRA (JP)
OGATA MASAFUMI (JP)
MIYAZAWA HIROSHI (JP)
SUGAWARA AKIRA (JP)
Application Number:
PCT/JP2014/054253
Publication Date:
September 25, 2014
Filing Date:
February 18, 2014
Export Citation:
Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
C25D5/12; C25D3/46; C25D7/00; H01H1/04; H01R13/03
Domestic Patent References:
| WO2013047628A1 | 2013-04-04 |
Foreign References:
| JP2012162775A | 2012-08-30 |
Attorney, Agent or Firm:
OKAWA, KOICHI (JP)
Koichi Okawa (JP)
Koichi Okawa (JP)
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