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Title:
SILVER PLATING MATERIAL, METHOD FOR PRODUCING SAME, AND TERMINAL COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/199526
Kind Code:
A1
Abstract:
Provided is a silver plating material comprising a substrate and a surface layer formed thereon, the surface layer being formed of a silver plating layer, wherein the crystal plane of the surface layer has (110) plane preferred orientation, and the (110) plane orientation percentage is 30% to 75%.

Inventors:
HIRAI YUTARO (JP)
ARAI KENTARO (JP)
SATO YOSUKE (JP)
Application Number:
PCT/JP2020/047671
Publication Date:
October 07, 2021
Filing Date:
December 21, 2020
Export Citation:
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Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
C25D3/46; C25D7/00
Domestic Patent References:
WO2015068825A12015-05-14
Foreign References:
JP2013076127A2013-04-25
JP2013189680A2013-09-26
JP2009079250A2009-04-16
JP2016204719A2016-12-08
JP2014181391A2014-09-29
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
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