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Patent Searching and Data


Title:
SILVER PLATING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2013/137121
Kind Code:
A1
Abstract:
A silver plating material having a silver plating film having a thickness of no more than 10 µm formed upon a raw material comprising copper or a copper alloy. The arithmetic average roughness (Ra) of the surface of the silver plating film is no more than 0.1 µm, and the {111} orientation ratio of the silver plating film is at least 35%.

Inventors:
SHINOHARA KEISUKE (JP)
OGATA MASAFUMI (JP)
MIYAZAWA HIROSHI (JP)
Application Number:
JP2013/056380
Publication Date:
September 19, 2013
Filing Date:
March 01, 2013
Export Citation:
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Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
C25D7/00; H01H1/025; H01H1/04; H01R13/03
Foreign References:
JP2008169408A2008-07-24
JP2010222647A2010-10-07
JP2002110136A2002-04-12
JP3889718B22007-03-07
JP4279285B22009-06-17
JP2010146925A2010-07-01
Other References:
See also references of EP 2826891A4
Attorney, Agent or Firm:
OKAWA, KOICHI (JP)
Koichi Okawa (JP)
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