Title:
SILVER POWDER AND PRODUCTION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/065341
Kind Code:
A1
Abstract:
Provided are a silver powder that has a low carbon content and is less likely to clump and a production method therefor. The silver powder is produced by means of dripping a molten metal obtained by melting silver whereto 40 ppm or more of copper was added, then rapidly solidifying same with high-pressure water spray. The resulting silver powder has a copper content of 40 ppm or higher, a carbon content of 0.1 mass% or lower, an oxygen content of 0.1 mass% or lower, a cumulative 50% particle size (D50 particle size) on a volumetric basis of 1-15 µm as measured with a laser diffraction particle size distribution measuring device, and an average particle size (SEM particle size) of free particles of 1-8 µm as observed with a field emission scanning electron microscope (SEM), wherein the ratio (SEM particle size/D50 particle size) of the average particle size (SEM particle size) of the free particles observed by the field emission scanning electron microscope to the cumulative 50% particle size (D50 particle size) is 0.3-1.0.
Inventors:
MICHIAKI YOSHIYUKI (JP)
YOSHIDA MASAHIRO (JP)
INOUE KENICHI (JP)
YOSHIDA MASAHIRO (JP)
INOUE KENICHI (JP)
Application Number:
PCT/JP2018/034336
Publication Date:
April 04, 2019
Filing Date:
September 18, 2018
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F1/00; B22F9/08
Foreign References:
| JP2017172043A | 2017-09-28 | |||
| JP2009235474A | 2009-10-15 | |||
| JP2013014790A | 2013-01-24 | |||
| JP2007263860A | 2007-10-11 |
Other References:
See also references of EP 3670028A4
Attorney, Agent or Firm:
OKAWA Koichi (JP)
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