Title:
SIMPLIFIED PROCESS AND APPARATUS FOR PRODUCTION OF COPPER FOIL
Document Type and Number:
WIPO Patent Application WO1999016935
Kind Code:
A3
Abstract:
A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of from about 40 to about 100 A/ft<2>, a plating time of greater than 30 seconds, and the electrolyte is a copper sulfate-sulfuric acid solution containing arsenic, chloride ions and 2 imidazalidinethione. The raw foil is transferred directly from a rotating drum cathode machine on which it is produced, at the same speed at which the raw foil is produced, and then to a barrier layer station, a stainproofing station and a chemical adhesion promoter station, after which it is dried and coiled to a station for applying the treatment.
Inventors:
YATES CHARLES B
WOLSKI ADAM
GASKILL GEORGE
CHENG CHINSAI T
BODENDORF KEITH
DUFRESNE PAUL
WOLSKI ADAM
GASKILL GEORGE
CHENG CHINSAI T
BODENDORF KEITH
DUFRESNE PAUL
Application Number:
PCT/US1998/020079
Publication Date:
August 24, 2000
Filing Date:
September 28, 1998
Export Citation:
Assignee:
CIRCUIT FOIL USA INC (US)
International Classes:
C25D1/04; C25D3/38; C25D5/10; C25D5/16; C25D7/06; H05K3/00; H05K3/38; H05K3/24; (IPC1-7): C25D5/16; C25D3/38; C25D5/10; C25D1/04; H05K3/38
Foreign References:
| US4549940A | 1985-10-29 | |||
| GB1042761A | 1966-09-14 | |||
| US3293109A | 1966-12-20 |
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