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Title:
SINGLE BOARD ASSEMBLY AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/085483
Kind Code:
A1
Abstract:
A single board assembly and an electronic apparatus pertaining to the field of electronic devices. The single board assembly comprises a cable provided with a cable terminal, a central processing unit provided with a connector, a clamping piece, a heat sink, a printed circuit board, a bracket, and a fixing member. The central processing unit is mounted on the substrate of the heat sink by the clamping piece. The bracket is mounted on the printed circuit board. The bracket is connected to the heat sink, and the central processing unit is inserted into the printed circuit board. The cable terminal is adapted to insert into the connector. The fixing member is disposed on the clamping piece or the substrate for fixing the cable terminal. By insertion of the connector, having the cable terminal pass through the printed circuit board of the single board assembly is avoided, thereby preventing components from striking each other. The printed circuit board does not need to be configured with a component keep-out area, thereby increasing the total area available for component deployment. Moreover, mounting of cables on the printed circuit board prior to fixation to the central processing unit is avoided, increasing operational space.

Inventors:
MAO, Yonghai (Huawei Administration Building, Bantian Longgang Distric, Shenzhen Guangdong 9, 518129, CN)
TANG, Yinzhong (Huawei Administration Building, Bantian Longgang Distric, Shenzhen Guangdong 9, 518129, CN)
Application Number:
CN2018/090623
Publication Date:
May 09, 2019
Filing Date:
June 11, 2018
Export Citation:
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Assignee:
HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian Longgang Distric, Shenzhen Guangdong 9, 518129, CN)
International Classes:
H01R13/639; H01R12/77
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