SINGLE-CHIP THREE-AXIS MAGNETIC FIELD SENSOR AND PREPARATION METHOD THEREFOR

Title:

SINGLE-CHIP THREE-AXIS MAGNETIC FIELD SENSOR AND PREPARATION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2015/144073

Kind Code:

A1

Abstract:

A single-chip three-axis magnetic field sensor and a preparation method therefor. The sensor comprises an X-axis sensor (3), a Y-axis sensor (4) and a Z-axis sensor (5) which are integratedly arranged on the same substrate (1), wherein the X-axis sensor (3) and the Y-axis sensor (4) have the same structure and are of a reference bridge structure. Magnetoresistance sensing elements (12, 14) on a reference arm are located beneath corresponding magnetic flux controllers (8, 9), and magnetoresistance sensing elements (11, 13) on a sensing arm are located in the gaps between the corresponding magnetic flux controllers (8, 9), but the distribution directions of all elements on the two sensors are perpendicular to each other, and magnetization directions of pinning layers of the magnetoresistance sensing elements are perpendicular to each other as well. The Z-axis sensor (5) is of a push-pull bridge structure, and magnetoresistance sensing elements (15, 16) on a push arm and a pull arm thereof are respectively arranged at the two sides of the upper part or the lower part of a magnetic flux controller (10) thereof in columns. Also disclosed is a preparation method for the single-chip three-axis magnetic field sensor. The single-chip three-axis magnetic field sensor has the advantages of simple manufacture and a wide dynamic range.

Inventors:

DEAK JAMES GEZA (CN)
LI DAN (CN)

Application Number:

PCT/CN2015/075146

Publication Date:

October 01, 2015

Filing Date:

March 26, 2015

Export Citation:

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Assignee:

MULTIDIMENSION TECHNOLOGY CO LTD (CN)

International Classes:

G01R3/00; G01R33/09

Foreign References:

CN103913709A	2014-07-09
CN203811786U	2014-09-03
CN102426344A	2012-04-25
CN103267955A	2013-08-28
CN203480009U	2014-03-12
CN102292773A	2011-12-21
US20090315554A1	2009-12-24

Other References: