Title:
SINGLE-LAYER PCB MICROFLUIDICS
Document Type and Number:
WIPO Patent Application WO/2012/145301
Kind Code:
A3
Abstract:
A printed circuit board structure is coated with an encapsulant within which microfluidic channels have been formed. The microfluidic channels are formed by soldering fluidic connections to metal traces on a surface of the printed circuit board structure prior to encapsulation. The metal traces are removed by etching after encapsulation to form microchannels within the encapsulant.
Inventors:
CHEN SAMSON (US)
RAJAGOPAL ADITYA (US)
SCHERER AXEL (US)
RAJAGOPAL ADITYA (US)
SCHERER AXEL (US)
Application Number:
PCT/US2012/033914
Publication Date:
December 27, 2012
Filing Date:
April 17, 2012
Export Citation:
Assignee:
CALIFORNIA INST OF TECHN (US)
CHEN SAMSON (US)
RAJAGOPAL ADITYA (US)
SCHERER AXEL (US)
CHEN SAMSON (US)
RAJAGOPAL ADITYA (US)
SCHERER AXEL (US)
International Classes:
G01N35/08; B81B7/00; F04B17/00
Foreign References:
| US20040013545A1 | 2004-01-22 | |||
| US20080101044A1 | 2008-05-01 | |||
| US20080057627A1 | 2008-03-06 | |||
| US20070095879A1 | 2007-05-03 | |||
| US5804881A | 1998-09-08 |
Attorney, Agent or Firm:
UENO, Daniel et al. (LLP155 N Lake Ave.,Suite 70, Pasadena California, US)
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