Title:
SINGLE USE CUTTING SUBSTRATE AND/OR SUPPORT SURFACE AND METHOD OF MANUFACTURE THEREOF
Document Type and Number:
WIPO Patent Application WO2003068492
Kind Code:
A3
Abstract:
A processing substrate comprises a first cut-resistant layer (60) having a first surface area and including a first absorbent ply and a thermoplastic material ply. The processing substrate further includes a second layer (62) having a second surface area and including a second absorbent ply and a thermoplastic material ply, wherein the first layer (60) is secured to the second layer (62) such that a portion of the second surface area is laterally disposed outside of the first surface area.
Inventors:
ACKERMAN BRYAN L
TRENT JOHN S
LEBOEUF WILLIAM E
KARUL VIRGINIA D
MCREYNOLDS KENT B
PRICE WILLIAM D
TRENT JOHN S
LEBOEUF WILLIAM E
KARUL VIRGINIA D
MCREYNOLDS KENT B
PRICE WILLIAM D
Application Number:
PCT/US2003/003957
Publication Date:
December 04, 2003
Filing Date:
February 11, 2003
Export Citation:
Assignee:
S C JOHNSON HOME STORAGE INC (US)
International Classes:
A47J47/00; B32B3/24; B32B7/02; B32B27/00; B32B7/00; B32B38/04; B32B38/06; D04H3/16; B32B37/12; B32B37/15; (IPC1-7): B32B3/02; B32B27/06; B32B7/02; A47J47/00
Domestic Patent References:
| WO2000078537A1 | 2000-12-28 |
Other References:
DATABASE WPI Section PQ Week 199727, Derwent World Patents Index; Class P28, AN 1997-292601, XP002244920
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