Title:
SINGULATED BODY FORMING DEVICE AND SINGULATED BODY FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/215952
Kind Code:
A1
Abstract:
Provided is a singulated body forming device capable of singulating an adherend to form a singulated body while minimizing application of tension to an adhesive sheet. The singulated body forming device EA is for singulating an adherend WF to form a singulated body CP and includes: a sheet affixing means 10 that affixes, to the adherend WF, an adhesive sheet AS to which expansion particulates SG that expand by having predetermined energy IR applied thereto are attached; a modified portion forming means 20 that forms a modified portion MT on the adherend WF and forms, on the adherend WF, a to-be-singulated region WFP that is enclosed by the modified portion MT; and a singulating means 30 that applies an external force to the adherend WF to generate a crack CK in the adherend WF starting from the modified portion MT, and singulates the adherend WF to form the singulated body CP. The singulating means 30 partially applies the energy IR to the adhesive sheet AS to expand the expansion particulates SG that are attached to an adhesive sheet portion ASP to which the energy IR has been applied, and displaces the to-be-singulated region WFP affixed to the adhesive sheet portion ASP to form the singulated body CP.
Inventors:
SUGISHITA YOSHIAKI (JP)
Application Number:
PCT/JP2018/047267
Publication Date:
November 14, 2019
Filing Date:
December 21, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; H01L21/683
Foreign References:
| JP2014086611A | 2014-05-12 | |||
| JP2013543262A | 2013-11-28 | |||
| JP2008132710A | 2008-06-12 | |||
| JP2012033636A | 2012-02-16 | |||
| US20160218039A1 | 2016-07-28 |
Attorney, Agent or Firm:
YAMAZAKI, Takahiro et al. (JP)
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