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Patent Searching and Data


Title:
SINTERED MATERIAL, CONNECTION STRUCTURE, COMPOSITE PARTICLE, JOINING COMPOSITION, AND METHOD FOR MANUFACTURING SINTERED MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/151313
Kind Code:
A1
Abstract:
Provided are a sintered material excellent both in thermal stress and joining strength, a connection structure provided with the sintered material, a joining composition whereby the sintered material can be manufactured, and a method for manufacturing the sintered material. A base part 1, a buffer part 2, and a filling part 3 are provided in the sintered material. The buffer part 2 and the filling part 3 are dispersed in the base part 1. The base part 1 is a metal sintered compact, the buffer part 2 is formed by a vacancy and/or a material not the same as the sintered compact, and the filling part 3 is formed by particles and/or fibers. The expression A > B is satisfied, where A is the kurtosis of the volume distribution of the buffer part in a three-dimensional image of the sintered material and B is the kurtosis of the volume distribution of the buffer part in a three-dimensional image of the sintered material with the filling part removed therefrom.

Inventors:
NOMOTO HIROYUKI (JP)
SASADAIRA MASAO (JP)
Application Number:
PCT/JP2018/005923
Publication Date:
August 23, 2018
Filing Date:
February 20, 2018
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C22C1/08; B22F1/10; B22F1/18; C22C1/05; B22F1/065; B22F1/0655; B22F1/17
Foreign References:
JP2000241095A2000-09-08
JP2004076043A2004-03-11
JP2011077225A2011-04-14
JP2014096545A2014-05-22
Other References:
See also references of EP 3584333A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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