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Title:
SINTERED OIL-RETAINING BEARING AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2017/110778
Kind Code:
A1
Abstract:
The present invention pertains to a sintered oil-retaining bearing in which a sliding surface (3) for supporting the outer peripheral surface of a shaft (11) and a helical oil supply surface (4) centered about the axial center of a shaft hole (2) are formed adjacent to each other in the inner peripheral surface of the shaft hole (2) through which the shaft (11) is inserted, the surface opening ratio in the sliding surface (3) is 10% or less, and the surface opening ratio of the oil supply surface (4) exceeds 10%. The present invention thereby makes it possible to supply a sufficient amount of oil to the sliding surface (3), to minimize the amount of supplied oil that moves to the interior from the sliding surface (3), to achieve a low coefficient of friction, and to improve the sliding characteristic of the bearing.

Inventors:
KOUNO, Hajime (Central Research Institute 476, Shimoishitoshimo, Kitamoto-sh, Saitama 23, 〒3640023, JP)
ISHII, Yoshinari (3-1-1 Kogane-cho, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
KATOU, Jyun (Central Research Institute 476, Shimoishitoshimo, Kitamoto-sh, Saitama 23, 〒3640023, JP)
Application Number:
JP2016/087885
Publication Date:
June 29, 2017
Filing Date:
December 20, 2016
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORPORATION (3-2 Otemachi 1-chome, Chiyoda-ku Tokyo, 17, 〒1008117, JP)
DIAMET CORPORATION (3-1-1, Kogane-cho Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
International Classes:
F16C33/10; F16C17/02; F16C33/14
Domestic Patent References:
WO2010080281A12010-07-15
WO2015050200A12015-04-09
Foreign References:
JPH11293304A1999-10-26
JPH0949062A1997-02-18
JPH0949064A1997-02-18
JPH0949047A1997-02-18
JP2008275115A2008-11-13
JP3094869U2003-07-04
JPH05115146A1993-05-07
JPH09250465A1997-09-22
JPH1161204A1999-03-05
JP2006009846A2006-01-12
Other References:
See also references of EP 3396186A4
Attorney, Agent or Firm:
AOYAMA, Masakazu (Seiyo Patent Office, 3F Shin-Chiyoda Kyodo Bldg. 3-3-9, Kandakajicho, Chiyoda-k, Tokyo 45, 〒1010045, JP)
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