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Title:
SINTERED PRODUCT AND LASER MARKING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/017256
Kind Code:
A1
Abstract:
A method according to one aspect of the present disclosure is a laser marking method for a compacted powder body that contains metal powder, the method comprising: a first step for irradiating a predetermined area on the surface of the compacted powder body with a laser beam having a lower first power, and melting and thereby smoothing the inside of the predetermined area; and a second step for forming dots, composed of recessed portions of a certain depth, at predetermined places in the predetermined area by means of a laser beam having a higher second power.

Inventors:
TERAI, Hiroaki (2901, Nariwa, Nariwa-cho, Takahashi-sh, Okayama 92, 〒7160192, JP)
TAUCHI, Masayuki (2901, Nariwa, Nariwa-cho, Takahashi-sh, Okayama 92, 〒7160192, JP)
NAWACHI, Kenji (2901, Nariwa, Nariwa-cho, Takahashi-sh, Okayama 92, 〒7160192, JP)
Application Number:
JP2018/026187
Publication Date:
January 24, 2019
Filing Date:
July 11, 2018
Export Citation:
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Assignee:
SUMITOMO ELECTRIC SINTERED ALLOY, LTD. (2901, Nariwa Nariwa-cho, Takahashi-sh, Okayama 92, 〒7160192, JP)
International Classes:
B23K26/00; B22F3/10; B23K26/354; B23K26/36; B22F1/00; C22C33/02; C22C38/00
Domestic Patent References:
WO2017002605A12017-01-05
Foreign References:
JPH05185714A1993-07-27
JPH1034359A1998-02-10
JP2011136347A2011-07-14
JP2008012567A2008-01-24
Attorney, Agent or Firm:
SUNCREST PATENT AND TRADEMARK ATTORNEYS (1-11, Sakaemachidori 4-chome Chuo-ku, Kobe-sh, Hyogo 23, 〒6500023, JP)
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