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Title:
SINTERED SILVER MICROPARTICLE COMPACT
Document Type and Number:
WIPO Patent Application WO/2013/133085
Kind Code:
A1
Abstract:
A sintered silver microparticle compact for a joint material that is used for the joining of a part of a semiconductor device, said sintered silver microparticle compact having such properties that the activation energy for the creeping of the sintered silver microparticle compact is 0.4- to 0.75-fold of the activation energy for the lattice diffusion of bulk silver.

Inventors:
KOBAYASHI MAKOTO (JP)
SASAKI KOJI (JP)
Application Number:
PCT/JP2013/054906
Publication Date:
September 12, 2013
Filing Date:
February 26, 2013
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
H01L21/52; B22F1/054; B22F7/08; B22F9/24; H01B5/00; H01L21/60
Foreign References:
JP2008133527A2008-06-12
JP2008010703A2008-01-17
JP2007324523A2007-12-13
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)
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